LISTSERV - TECHNET Archives - LISTSERV.IPC.ORG

TECHNET Archives

September 2002

TechNet@IPC.ORG

	LISTSERV Archives
	TECHNET Home
	TECHNET September 2002

	Log In
	Register

	Subscribe or Unsubscribe

	Search Archives

Options:	Use Monospaced Font Show Text Part by Default Show All Mail Headers
Message:	[<< First] [< Prev] [Next >] [Last >>]
Topic:	[<< First] [< Prev] [Next >] [Last >>]
Author:	[<< First] [< Prev] [Next >] [Last >>]

Subject:	Re: Copper Tin Intermetallic Growth Rate
From:	Werner Engelmaier <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Mon, 9 Sep 2002 13:28:12 EDT
Content-Type:	text/plain
Parts/Attachments:	text/plain (18 lines)

Hi Brian,
I am in agreement with you. My only squabble is that I think the reduction 
from 15 µm of plating before reflow to 12 µm over the surface after reflow 
has more to do with the porosity of the plating rather than IMC formation.

Werner

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2

LISTSERV.IPC.ORG