TECHNET Archives

September 2002

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 9 Sep 2002 10:13:00 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (31 lines)
Technetters-

We are getting 1mm BGA devices with these mechanical defects (see attached*
for link to picture) from testing processes at the vendor.

These devices have excessive voiding when reflowed on to a board with other
BGAs that do not have a voiding problem.  The vendor insists it is our
process that causes the voiding.

Question-  would you expect this mechanical damage to lead to voiding in
the reflowed joint?


*
http://www.ofoto.com/ShareLandingSignin.jsp?UV=922011120789_31499403105&US=0&Upost_signin=OrderPhotos.jsp%3FshowSlide%3Dtrue&Un=774560513&Um=54718403105.84079403105



Al

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2