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September 2002

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Subject:
From:
Earl Moon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 9 Sep 2002 08:16:48 -0500
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Joyce,

Back in the old through hole days, when plating and fusing with peanut oil,
the surface condition was primo and lasted in military use for years. Of
course then we didn't know as much. Werner's comments on edge intermetallic
growth, and possible oxidation on the edges as the plating "pulls" back to
form the well known dome, make sense to me. However, my thoughts are of
going back in time, or doing it now, and using a modern hot air reflow oven
has me interested but the solder plating thickness would be a bit much using
the old plating process requirement I think was ,0003" minimum but maybe it
could be thinner now to achieve a flat surface.

I think Teledyne's old operation, before whoever bought them discontinued
using the process on component leads that soldered great, was the last to
use it. Nothing has been the same since.

Earl

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