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September 2002

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Subject:
Re: Copper Tin Intermetallic Growth Rate
From:
joyce <[log in to unmask]>
Reply To:
[log in to unmask]
Date:
Mon, 9 Sep 2002 08:17:23 -0400
Content-Type:
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text/plain (46 lines) 
Moonman,
I am not sure about that for long term storage... all depend upon how good
is the plating to start with and the clealiness of the parts after fusing.
my 2 cents.
                                                            jk

>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]]On Behalf Of Earl Moon
>Sent: Saturday, September 07, 2002 9:37 PM
>To: [log in to unmask]
>Subject: Re: [TN] Copper Tin Intermetallic Growth Rate
>
>
>No intermetallic issues with this. Tin/lead plating that was fused was the
>best solderable surface ever. Damn shame we can't make it flat.
>
>MoonMan
>
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