Werner and Brian,

I sure agree they must be reflowed. It almost makes me want to go back to
Brian's time, and mine (Werner, I'm sure you're much to young), and used
more modern convection reflow processes as the direct IR sure made a mess of
things - popcorn hell that.

Earl

----- Original Message -----
From: "Werner Engelmaier" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Sunday, September 08, 2002 9:59 AM
Subject: Re: [TN] Copper Tin Intermetallic Growth Rate


> Hi Ted,
> You do NOT want to store plated tin/lead for any length of time. This
layer
> is porous and does not protect the underlying surface, and IMC formation
is
> certainly also a possibility. The is why plated tin/lead finishes get
> reflowed/HASLed very quickly after PCB production.
>
> Werner Engelmaier
>
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