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September 2002

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Fri, 6 Sep 2002 08:44:54 -0400
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fyi

http://www.intel.com/design/packtech/Ch_14.pdf

>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]]On Behalf Of Lum Wee Mei
>Sent: Friday, September 06, 2002 3:41 AM
>To: [log in to unmask]
>Subject: [TN] Impact of Board Warpage on BGAs assembly
>
>
>Hello there,
>
>I have some input on board bow & twist value for BGAs assembly from some
>kind souls. However, I was looking for more articles written on BGAs
>with relationship to the followings areas :
>1. board bow & twist (warpage) on BGAs assembly
>2. Soldering, inspections and Thermal profiling for BGAs assemblies
>3. Layout design criteria for BGAs including how the no. of layers,
>routing pattern can be determined
>4. Assembly processes - the considerations and constraints, etc
>5. Assembly setup for BGAs assembly - equipment, tools, etc for
>prototyping.
>
>Thanks and regards
>Wee Mei
>
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