Technetters-
We are getting 1mm BGA devices with these mechanical defects (see attached*
for link to picture) from testing processes at the vendor.
These devices have excessive voiding when reflowed on to a board with other
BGAs that do not have a voiding problem. The vendor insists it is our
process that causes the voiding.
Question- would you expect this mechanical damage to lead to voiding in
the reflowed joint?
*
http://www.ofoto.com/ShareLandingSignin.jsp?UV=922011120789_31499403105&US=0&Upost_signin=OrderPhotos.jsp%3FshowSlide%3Dtrue&Un=774560513&Um=54718403105.84079403105
Al
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