I don't think that intermittent failures could be detected by X-ray, because
cracks are very hard to see with this method. If the failure is not related
to cracks you have a chance.
Gaby
----- Original Message -----
From: "Peter Lee" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, September 18, 2002 2:23 AM
Subject: [TN] BGA failure and Rework


> Technet,
>
> If I may continue my question on BGA rework process:
>
> Recently we have seen intermitted failures from a few BGA assemblies.
> After removing the suspicious BGA on the rework station we noticed
> dewetting on a majority number of pads of the removed BGA. The solder
> ball residues were mostly attaching to the board.
>
> Has anyone seen this before? How likely can this be caused by a
> non-optimum rework removal profile Is baking of the board normal prior
> to rework (removal/re-placement)?
>
> We are tackling this issue from the part supplier side and looking at
> performing destructive X-ray analysis. Can someone give me an idea of
> what the ball attachment process is on the BGA?
>
> Rgds,
> Peter
>
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