Hi John,
>The second issue of embrittlement, however, many not be so much of an issue
>- some task group members have calculated that the percentage of gold in
>solder, in cases of 30 µin depositions, is less than 4% and that gold 
embrittlement
>is not really a problem.
This calculation is technical nonsense, because (1) it assumes uniform 
distribution of Au which is virtually never the case, (2) the 4% number is 
not a hard-and-fast limit, but a very general guideline. Thus, gold 
embrittlement cannot be dismissed based on ths argument.

Best regards,
Werner Engelmaier