Hi Bob,

Use well-cleaned stencils.
Don't displace SMD's manually after placement and before reflow
soldering.
Make sure your solder paste is stored according to manufacturers
recommendations.
Do a solder balling test to see if your paste is doing okee
Don't mix old solderpaste with fresh material.
Check if temperature-rise during preheat conforms with manufacturers
recommendation.
Make sure the relative humidity is below 70%, or even better: below
60%
Check accuracy of the stencilprinter (you'll want paste only on the
pads)
Enough preheat during wave soldering ?  (you want the board to be dry
when it hits the wave)
Check the level of the chipwave.
Could it be that the boards are outgassing during wavesolder
(blowholes) ?

You heard all this before, didn't you ;->

Daan Terstegge
Unclassified mail
Personal Website: http://www.smtinfo.net


-----Original Message-----
From: Bob Arciolla [mailto:[log in to unmask]]
Sent: Tuesday, August 06, 2002 2:31 PM
To: [log in to unmask]
Subject: Solder fines on printed circuit boards



Can anyone please help and give me input on the cause of solder fines
and how to remove and/or prevent them.
Thank you,

Bob Arciolla
Quality Manager
Endicott Research Group

[log in to unmask]
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847-509-9700 ext.5315
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