Hi Mark,
As the industry continues to move more towards flip chip, there will
certainly be a market for a substrate that that doesn't require underfill.
However, in any commercial arena, COST is always the bottom line. A product
you mention would have to be compared to its competing products and the
costs, however it is calculated, compared. If the cost of the new product
can NOT be shown to be lower than, or equal to aluminum core or even FR-4,
little interest will be generated.
Regards,
Ryan Grant
-----Original Message-----
From: Mark Mazz [mailto:[log in to unmask]]
Sent: Thursday, August 29, 2002 5:48 PM
To: [log in to unmask]
Subject: [TN] Thermal core for PCB's
A question for designers and OEM's:
Some of you probably use aluminum cores for your boards for thermal
management. Some may even include CIC or other constraining layers along
with thermal cores.
My question: If someone were to develop a carbon-based material with similar
thermal properties close to aluminum (200 W/mk), with a CTE in the 1-3
range, with a density of 2-3, and other desirable attributes, how much
interest would there be for commercial PCB's? This material could be used
as the thermal management core as well as constraining layers for improved
CTE control towards the outer layers. It would plate well so thermal via's
would also be possible for even faster heat dissipation.
Any thoughts on the subject?
The Unknown Engineer
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