This is a very good idea. It is an idea that first was tried in serious
military/aerospace applications in the 80's. It worked reasonably well and
may find some applications today.

If you could get some sort of diamond based material to work that would
advance the thermal cause. Using either carbon, or its big brother diamonds,
provides excellent thermal transfer potential and the CTE, even though
negative by itself, would work well too. One of the biggest problems is
getting the material to market as an unreinforced sheet - no glass fibers at
an affordable, whatever that is, price..

Bring it on.

Unknown MoonMan

----- Original Message -----
From: "Mark Mazz" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, August 29, 2002 5:48 PM
Subject: [TN] Thermal core for PCB's


> A question for designers and OEM's:
>
> Some of you probably use aluminum cores for your boards for thermal
> management.  Some may even include CIC or other constraining layers along
> with thermal cores.
>
> My question: If someone were to develop a carbon-based material with
similar
> thermal properties close to aluminum (200 W/mk), with a CTE in the 1-3
> range, with a density of 2-3, and other desirable attributes, how much
> interest would there be for commercial PCB's?  This material could be used
> as the thermal management core as well as constraining layers for improved
> CTE control towards the outer layers.  It would plate well so thermal
via's
> would also be possible for even faster heat dissipation.
>
> Any thoughts on the subject?
>
> The Unknown Engineer
>
>
> _________________________________________________________________
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>
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