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August 2002

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Subject:
From:
"Morse, Carrie" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 29 Aug 2002 18:36:11 -0400
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Dave,
Are the boards you are running double sided SMT?



-----Original Message-----
From: Dave Chapman [mailto:[log in to unmask]]
Sent: Thursday, August 29, 2002 4:01 PM
To: [log in to unmask]
Subject: Re: [TN] DDarkly comment re OSP vs White Tin, etc


We have been having great results with Immersion Silver as a drop in
replacement for our HASL and OSP product. 
Dave Chapman
Manufacturing Engineer
Circuit Service Inc.

-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Thursday, August 29, 2002 12:53 PM
To: [log in to unmask]
Subject: [TN] DDarkly comment re OSP vs White Tin, etc


I agree that OSP has a lot of virtues and it has improved greatly in the
last 10 years.  Particularly in terms of storage, thermal cycles, less
dependence upon reflow in an inert atmosphere.
However, in any application, the post-assembly environment has to be taken
into consideration.  In Barbīs application, OSP was considered but the
product has to survive in potentially humid environments and thus the long
term impact on reliability has to be taken into consideration.
There is still no panacea surface finish for the industry - at least not
yet.  Everything is application specific.

Phil Zarrow
ITM Consulting
Durham, NH  USA
www.ITMconsulting.org

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