TECHNET Archives

August 2002

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 29 Aug 2002 13:57:02 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (76 lines)
Metal film, thick film, carbon comp, carbon film, temperature
coefficent, temination finish, approved suppliers by program, carrier
media. Resistors are easier than capacitors, which are easier than
actual semiconductors. It looks a lot easier than it is.

The best solution is to take care of them one at a time as the mergers
take place, each one is an engineering change. I know of no short cuts.
Oh, the stories I could tell you.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Smith, Richard
> Sent: Thursday, August 29, 2002 11:47 AM
> To: [log in to unmask]
> Subject: [TN] Part Consolidation
>
>
> Folks,
>
> As a result of mergers we now have many duplicate and
> triplicate parts with different part numbers in our ERP
> (ORacle) system. For example 3 resistors part numbers - 123,
> 456 and 789, all are 1K, 5%, 1/8W, 0805.
>
> The apparent solution (to maximize buying power and drive
> MRP) would be to assign a common part number. But, if all the
> duplicate and triplicate parts
> (thousands) are changed to a common part number at least 66%
> of the schematics, CAD data, libraries, etc. will require
> changes. Hopefully there's a less costly solution.
>
> Is there anyone out there that can provide some insight?
>
> Thanks,
> Rick
>
>
>
> Richard G. Smith
> CAD Services Manager
> C-COR Broadband Communications
> 999 Research Parkway
> [log in to unmask]
> Meriden, Ct. 06450
> PH: 203-639-7670
> FX: 203-317-4421
> www.c-cor.net
>
> --------------------------------------------------------------
> -------------------
> Technet Mail List provided as a free service by IPC using
> LISTSERV 1.8e To unsubscribe, send a message to
> [log in to unmask] with following text in the BODY (NOT the
> subject field): SIGNOFF Technet To temporarily halt or
> (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE
> mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest Search the archives of
> previous posts at: http://listserv.ipc.org/archives Please
> visit IPC web site http://www.ipc.org/html/forum.htm for
> additional information, or contact Keach Sasamori at
> [log in to unmask] or 847-509-9700 ext.5315
> --------------------------------------------------------------
> -------------------
>

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2