I don't know what testing you were expecting for these parts but it's quite
common for a wire bond to function well before reflow but break sometime
during the cycle. Unless you carried out 100% thermal cycling before test the
manufacturer could well ship parts which would fail.



> [log in to unmask] wrote:
>
> Steve,
>
> Looks like someone at On Semiconductor will be as embarrassed as hell!
>
> Let's see them try to blame those assembly problems on YOU!!
>
> Ha!! Someone had a REALLY bad day at the die and wire bonders!
>
> Doesn't say to much for 100% testing before going out the door does it!?
>
>
>
>
> Looks like someone got the scrap bin and ship bins mixed up  .... or needed
> to get some 'numbers'     ----- unfortunately, have experienced both
>
> NAIL 'EM !!!
>
> Steve Creswick - Gentex Corp
>
>      -----Original Message-----
>      From: Steve Gregory [mailto:[log in to unmask]]
>      Sent: Wednesday, August 28, 2002 4:17 PM
>      To: [log in to unmask]
>      Subject: [TN] MUX Failures...an update.
>
>      Hi All!
>
>      The the first results back from failure analysis on the On
>      Semiconductor MC14051BD
>      parts. I sent 4 parts out that were removed from confirmed test
>      failures.
>
>      On 2 of the parts the problem was determined at level 1 analysis.
>      The other 2 parts will need to go on to level 2 analysis as
>      nothing was spotted at level 1.
>
>      Go to: http://www.stevezeva.homestead.com and look at the pictures
>      of "The Good, The Bad, and The Ugly" and see if you can spot why
>      these parts failed...
>
>      You might have to look really, really close to see the
>      problems...but then again you might not.
>
>      -Steve Gregory-
>      ---------------------------------------------------------------------------------
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--
Eric Christison
Mechanical Engineer
STMicroelectronics
33 Pinkhill
Edinburgh
EH12 7BF

tel:    +44 (0)131 336 6165
fax:    +44 (0)131 336 6001

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