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August 2002

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Subject:
From:
Earl Moon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 29 Aug 2002 02:38:51 -0500
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You make a good point Gaby. The process problems began before the process
was initiated as possible programming errors. The bonds never were made.

Decapping may have caused the specimen's crash and burn areas next on the
chip edge but, as you say, they should have been honest enough to report
this issue or possible problem. I think they would have done that as
decapping is a crude process at times. I still like to envision a wire bond
head crashing into the edge and not making the bond as well.

As far a how you work with the supplier - you do or you don't. I mean, you
have objective evidence that you could not possibly have caused the problem
by poor handling techniques. This failure, whether or not as I describe it,
is not a handling or ESD issue. It clearly is a problem for the supplier.

Again, as we all have been down this road before and will again with COTS,
we must present the evidence to the supplier. If the supplier is unwilling
to work with you, you do what you must and will win - what is the question?
If you have another successful supplier, use them only.

MoonMan

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