Victor,

You can find it in Mil-Std-883, Method 2017. Die attach material (typically
a polymeric adhesive) 1/2 way up the die side is the ideal condition. It can
come to the top edge of the die but should not flow onto the top surface. At
least 50% of the die perimeter should exhibit a visible fillet.

Regards,
Bruce Misner

> ----------
> From:         Victor Hernandez[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;[log in to unmask]
> Sent:         Tuesday, August 27, 2002 2:22 PM
> To:   [log in to unmask]
> Subject:      Re: [TN] Die attach/bonding  material
> Importance:   High
>
> Mr. MoonMan & Fellow TechNetters
>
>    Can you please direct me to some literature/Requirement for die
> attach/bonding material thickness.   Min and Max thickness.  How far
> up the thickness of the die can the bonding material cover.
>
>   Along that same line what is the skew aloud.
>
> victor,
>
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