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| Reply To: | TechNet E-Mail Forum. |
| Date: | Wed, 28 Aug 2002 07:33:48 -0500 |
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IMHO, some of the best information regarding die attach (alloy or polymeric) can be found in good old MIL-STD 883 (Method 2017 section 3.1.2, Element Attach) Note: a lot depends on the specific type of component due to defining active circuit area. If you have specifics feel free, this has been my area for over 20 years.
Bill C.
Advanced Manufacturing Engineer
NorLux Corp.
-----Original Message-----
From: Victor Hernandez [mailto:[log in to unmask]]
Sent: Tuesday, August 27, 2002 1:22 PM
To: [log in to unmask]
Subject: Re: [TN] Die attach/bonding material
Importance: High
Mr. MoonMan & Fellow TechNetters
Can you please direct me to some literature/Requirement for die
attach/bonding material thickness. Min and Max thickness. How far
up the thickness of the die can the bonding material cover.
Along that same line what is the skew aloud.
victor,
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