Don't have an answer to your question, but we're struggling with similar
issues regarding claims to meet the requirements of J-STD-001.  (We're
looking at switching from MIL-2000 to IPC.)  My guess is that many companies
(none associated with Technet, of course) who state that they meet these
requirements just ignore these paragraphs.  I'll bet that very few companies
would pass an extensive audit (paragraph by paragraph) to the J-standard.

Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879


        -----Original Message-----
        From:   Guy Ramsey [SMTP:[log in to unmask]]
        Sent:   Tuesday, August 27, 2002 8:25 AM
        To:     [log in to unmask]
        Subject:        [TN] J-STD-001 Solderability test requirements

        I received the following message, the names have been changed to
protect the innocent.

        I was given the assignment to resolve an audit finding from Big
Aero-Space Contractor (BASC) against  Big Electronic Manufacturing Service
Provider (BEMS). Hardware for a BASC program is designed at BEMS. This
hardware has been manufactured since the late 1980s. BEMS recently signed a
new contract, which invoked J-STD-001C, but none of our internal standards
were modified. BEMS Engineering and Manufacturing were caught off guard .
BASC audited the BEMS facility and an audit issue known as a CRIER was
placed against BEMS. I have worked with BASC and provided comparison
information on how BEMS meets the intent of the J-STD-001C. Only one issue
remains, but and I'm struggling to resolve it. The remaining issue involves
the J-STD-001C requirement for solderability testing. I discussed the matter
with our distributors, BOW and GHOST. Both our suppliers said most of the
parts we buy are MIL, already tested and don't need to be tested again. Some
of their C of C certify solderability others do not. Below is the response
from the BASC Quality Manager.

        BEMS to get a C of C from all their suppliers with each lot for the
BASC Program stating that the "components have been solderability tested in
the past six months" and we will close this out.

        BASC Program Quality Manager

        So people, here is the requirement

        5.2 Solderability    Electronic/mechanical components and wires to
be soldered shall meet the requirements of J-STD-002 or equivalent, and
printed boards shall meet the requirements of J-STD-003 or equivalent. When
a pretinning and inspection operation is performed as part of the documented
assembly process, that operation may be used in lieu of solderability
testing.

        BEMS maintains that they have historical data indicating that
satisfying this requirement will not improve the process and will add to the
cost of the program.

        Any of you out there building under contract to J-STD-001C? How do
you meet this requirement?


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