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August 2002

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Subject:
Re: Die attach/bonding material
From:
Victor Hernandez <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 27 Aug 2002 13:22:24 -0500
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Mr. MoonMan & Fellow TechNetters

   Can you please direct me to some literature/Requirement for die
attach/bonding material thickness.   Min and Max thickness.  How far
up the thickness of the die can the bonding material cover.

  Along that same line what is the skew aloud.

victor,

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