<< Anyone out there have any information or input into the acceptability of
 putting an electronics assembly back through a wave process a second time as
 part of a rework process?
  >>

Kevin,
    I did a lot of this during my Process Engineering days at
McDonnell-Douglas in St. Louis.  We did a study of the cost trade-off of the
time to touch up all of the defects vs. the time to re-inspect the board and
do the reduced (hopefully) amount of touch-up required.  If I remember right
that break even point came out somewhere around 40 solder connections per
board.  We also had to make sure to apply a spray of flux to the topside of
the board before the second wave pass, or else the inspectors would reject
the entire board for solder defects on the topside of each PTH joint.  We
also found that we had to run the preheaters about 5% hotter due to the
increased mass.

Jon Moore

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