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August 2002

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Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 26 Aug 2002 07:48:12 -0400
Content-Type:
text/plain
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text/plain (65 lines)
Try IPC-7525; with IPC-SM-782 land patterns the ratios in the stencil
design guide will generally give good results. Bridging and insufficient
. . . that hurts.

Your mileage may vary.


> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of My Nguyen
> Sent: Saturday, August 24, 2002 8:08 PM
> To: [log in to unmask]
> Subject: [TN] Stencil (Open) Aperture for No Clean and W.S.
>
>
> Ladies and Gentlemen:
>
> Do you have any standard, or rule about the Stencil
> Aperture for No Clean and W.S for SMT product?
>
> Is there any site that contain those information?
>
> We have had problem with solder balls (No-Clean),
> in-sufficient solder (for both No Clean and W.S), and
> Bridging which we have found out that the root was the
> imperfect design of the stencil aperture.
>
> Your help is greatly appreciated!
>
> Stacy
>
>
>
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