Ladies and Gentlemen:

Does JEDEC have any rules, standards, or guideline for
component pad-geometry?  I know IPC has it (IPC-782)
but how about JEDEC?

It would be nice if I can compare the two.  Our
lay-out Engineer followed none of them which gave us
too many problems, ie. component overhang, solder
open, bridging, tombstone, etc.

Your help is always greatly appreciated!

Stacy

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