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August 2002

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Subject:
information regarding testing of bonding strength between gold immersion layer and nickle layer
From:
Jack Low <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 22 Aug 2002 17:04:11 +0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (40 lines) 
>  -----Original Message-----
> From:         羅廣明  
> Sent: Thursday, August 22, 2002 2:45 PM
> To:   [log in to unmask]
> Subject:      message:subscribe jack low technet
> 
> 
>  -----Original Message-----
> From:         羅廣明  
> Sent: Wednesday, August 21, 2002 2:40 PM
> To:   [log in to unmask]
> Subject:      any methods related to testing bonding capability between gold immersion coating layer and nickle layer
> 
> dear all:
> 
> we would like to know if there is any method to test  bonding capability between  immersion  gold coating layer and nickle layer, there    are supposed to be other methods to test bonding strength instead of  using 3M tape mentioned in ipc-Tm 650 . Could  you provide us with related information about what could result in poor solderability after device mounting due to poor bonding strength between gold immersion coating layer and  nickle layer capability , is there any connection to poor bonding mentioned above that could contribute to dewelding or non-welding, 
> we will appreciate whatever you could offer, Thanks!  Have a nice day!
> 
> 
> Best regards 
> 
> Q.A  Dept 
> 
> Jack low
> 
> e-mail  [log in to unmask]
> 
> Tel:  03-4511277 exe: 365 or 366 

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