Victor,

generally speaking, Au/PdNi/Ni is a better contact finish than Au/Ni. This
is mainly due to the increased hardness and decreased porosity of
Au/PdNi/Ni compared to Au/Ni. The downside of PdNi finish is the Pd price,
which has been high and volatile until few months ago. I will e-mail you
some papers directly to your e-mail address (don't want to overload this
mailing list).

Chen

Chen Xu
Enthone, Inc.
CRL
600 Route 440
Jersey City, NJ07304
Tel. (201)-4346778 ext. 2042 (o)
                                     ext. 2051 (lab)
Fax. (201)-4342529
[log in to unmask]




                    Victor Hernandez
                    <Victor_G_Hernandez       To:     [log in to unmask]
                    @DELL.COM>                cc:
                    Sent by: TechNet          Subject:     [TN] Connector Contact Finish
                    <[log in to unmask]>


                    08/21/2002 02:29 PM
                    Please respond to
                    "TechNet E-Mail
                    Forum."; Please
                    respond to
                    Victor_G_Hernandez






Fellow TechNetters,

    Requesting for Pro and Cons on the following Connector Surface Plated
finish;

        1.)  Base material/Ni/Au   - Ni is > 250 micro inches and hard Au
30
micro inches

        2).  Base material/Ni/PdNi/FLASH Au - Gold FLASH over Pd/Ni ( 30
micro inches Min. over Ni 50 micro inches Min.

   Os the robustness of this two application the same .   I welcome all
comments and publication on process #2.

Victor G. Hernandez
Component/Material Failure Analysis Eng.
PS4-1, Rm. 132
Ofc:     512-725-3471
Pgr:     512-907-0005

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