TECHNET Archives

August 2002

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 2 Aug 2002 15:30:13 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (67 lines)
The short answer is no. If your suppliers process provides adequate
protection to ensure solderability of the an immersion tin coating. And
adequate process methods to ensure acceptable process results from and
immmersion tin, then they should get acceptable performance from
immersion silver.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack C. Olson
> Sent: Friday, August 02, 2002 2:23 PM
> To: [log in to unmask]
> Subject: [TN] ASSY: Immersion Silver vs. Tin
>
>
> Greetings,
>
> A situation has come up that is beyond my experience.
>
> We sent some Immersion Silver boards to an assembly
> vendor and recieved an email saying:
>
> "We are progressing on your boards. The bad news is
> that the white tin flash used on the pads is awful.
> The solder is reflowing irregularly, if at all.
> We suspect that we'll have to touch every joint on
> every part to make a good connection."
>
> So my question to the group is:
> Is there a difference from an assembly process point of view
> between tin and silver?
>
> I'm hoping the root problem is related to their assumption
> that our silver boards were tin, but I don't know enough
> about it.
>
> Thanks in advance for any clues....
>
> Jack
>
> --------------------------------------------------------------
> -------------------
> Technet Mail List provided as a free service by IPC using
> LISTSERV 1.8e To unsubscribe, send a message to
> [log in to unmask] with following text in the BODY (NOT the
> subject field): SIGNOFF Technet To temporarily halt or
> (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE
> mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest Search the archives of
> previous posts at: http://listserv.ipc.org/archives Please
> visit IPC web site http://www.ipc.org/html/forum.htm for
> additional information, or contact Keach Sasamori at
> [log in to unmask] or 847-509-9700 ext.5315
> --------------------------------------------------------------
> -------------------
>

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2