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August 2002

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Subject:
From:
Victor Hernandez <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 21 Aug 2002 13:29:01 -0500
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Fellow TechNetters,

    Requesting for Pro and Cons on the following Connector Surface Plated
finish;

        1.)  Base material/Ni/Au   - Ni is > 250 micro inches and hard Au 30
micro inches

        2).  Base material/Ni/PdNi/FLASH Au - Gold FLASH over Pd/Ni ( 30
micro inches Min. over Ni 50 micro inches Min.

   Os the robustness of this two application the same .   I welcome all
comments and publication on process #2.

Victor G. Hernandez
Component/Material Failure Analysis Eng.
PS4-1, Rm. 132
Ofc:     512-725-3471
Pgr:     512-907-0005

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