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August 2002

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Subject:
From:
"Jack C. Olson" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 2 Aug 2002 13:23:09 -0500
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Greetings,

A situation has come up that is beyond my experience.

We sent some Immersion Silver boards to an assembly
vendor and recieved an email saying:

"We are progressing on your boards. The bad news is
that the white tin flash used on the pads is awful.
The solder is reflowing irregularly, if at all.
We suspect that we'll have to touch every joint on
every part to make a good connection."

So my question to the group is:
Is there a difference from an assembly process point of view
between tin and silver?

I'm hoping the root problem is related to their assumption
that our silver boards were tin, but I don't know enough
about it.

Thanks in advance for any clues....

Jack

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