See there, you got a new computer out of this.  That in its self has to be
worth a chuckle
or two.


----- Original Message -----
From: Earl Moon <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, August 20, 2002 4:21 AM
Subject: Re: [TN] It Should Be All Over


> I agree completely. I now have asked David Bergman permission to place IPC
> graphics and tables in my book. I should have asked him before. IPC had no
> problem when I was giving the check lists away with IPC graphics and
tables
> clearly present. Therefore, without thinking, I placed them in my book and
> offered it for sale.
>
> I surely hope IPC allows me the privelage of using their property. It is
for
> the benefit of us all, in my view. I sell books. IPC gets more customers
for
> their product.
>
> My book is not about profit. If I sell very many, whatever number that is,
I
> will continue upgrading the book and cover my expenses and that's about
it.
> This is not a scheme or gimmick contrived to ensure my retirement.
>
> When I started receiving orders and money for the book, I had to buy many
> things just to fill the orders. So far, I have spent over $4000 on a new
> computer and support peripherals. I doubt I'll ever recover that money
plus
> other monies that need to be spent notwithstanding my time invested over
the
> past 20 years supporting IPC.
>
> Never the less, book is still for sale with or without IPC permission to
use
> their fine material. Simply, I have obtained David's kind permission to
> reference IPC material in lieu of actual images and tables. However, my
> book, without IPC, will contain my own graphics and tables though this
will
> take a bit more time than anticipated.
>
> I go back to IPCs beginings in the '60's. I may have contributed more
> indirectly to the organizations success than anyone still living. There is
> not a company withing which I have worked, that I have not had success in
> having them become IPC members. This includes my most recent client in
> Cleveland, OH as ECC. Also, I have been instrumental, whether companies
> become members or not, in having them buy many vital, to the companies,
IPC
> documents.
>
> My current book references and requires as part of the DFM/CE process the
> following documents at a minimum:
>
>
> 2)
> All component and printed circuit board design requirements and issues
> clearly defined as a function of the POD design envelope, PCB and PCBA
> processes, and IPC guidelines and other guidelines and specifications as:
>
> ?
> IPC-D-275, Printed Wiring for Electronic Equipment
> ?
> IPC-D-279, Design Guidelines for Reliable Surface Mount Technology Printed
> Board Assemblies
> ?
> IPC-2221, Generic Standard for Printed Board Design
> ?
> IPC-7095, Design and Assembly Process Implementation for BGA?s
> ?
> IPC-782, Surface Mount Design and Land Pattern Standard
> ?
> IPC-785, Guidelines for Accelerated Testing of Surface Mount Solder
Attachments
> ?
> IPC-4101, Laminate/Prepreg Materials Standard for Printed Boards
> ?
> IPC-7525, Stencil Design Guidelines
> ?
> IPC-2315, Design Guide for High Density Interconnects (HDI) and Microvias
> ?
> IPC-CM-770, Guidelines for Printed Board Component Mounting
> ?
> IPC-SM-840, Qualification and Performance of Permanent Polymer Coating
> (Solder Mask) for Printed Boards
> ?
> IPC-9701, Performance Test Methods and Qualification Requirements for
> Surface Mount Solder Attachments
> ?
> IPC-780, Component Packaging With Emphasis on Surface Mounting
> ?
> IPC-A-600F, Acceptability of Printed Boards
> ?
> IPC-A-610C, Acceptability for Electronic Assemblies (ESD requirements in
> Section 3.0)
> ?
> IPC-6012, Qualification and Performance Specification for Rigid Printed
Boards
>
> Joint Industry Standards as:
>
> ?
> ANSI/J-STD 001, Requirements for Soldered Electrical and Electronic
Assemblies
> ?
> ANSI/J-STD 002, Solderability Tests for Component Leads, Terminations,
Lugs,
> Terminals, and Wires
> ?
> ANSI/J-STD 003, Solderability Tests for Printed Boards
> ?
> ANSI/J-STD 013, Implementation of Ball Grid Array and Other High Density
> Technology
> ?
> ANSI/J-STD 020, Handling Requirements for Moisture Sensitive Components
> ?
> ANSI/J-STD 033, Standard for Handling, Packing, Shipping, and Use of
> Moisture/Reflow Sensitive Surface Mount Devices
>
> ?
> IEEE 1149.1, Standard Test Access Port and Boundary Scan Architecture
>
> Note: The foregoing documents, at a minimum, must be available for
reference
> at POD before any type design review is possible. Other considerations and
> requirements follow:
>
> This is straight out of my book. If this doesn't sell IPC documents, I
don't
> know what will.
>
> My book is not about the MoonMan. I have fun with him and so do many
others.
> He loves to have fun but is dead serious about our business.
>
> I agree as well that this forum is not the place to work this out. I
agree,
> I should have sought permission but, being my GIVING self mad a stupid
> assumption based on my free check lists, that IPC would love my stuff.
>
> I must not be a very good engineer. Good engineers never assume anything.
>
> Thanks again to everyone paying attention to this thing I shoul never have
> created. The responses, both on and off line, have been tremendous.
>
> The book still is for sale and, hopefully, with IPC permission to do more
> than reference their graphics and tables. My presentations, seminars,
> workshops, and consulting still will go on and I hope IPC doesn't object
to
> using their material, when purchased by member or not, customers in
slides,
> ppt presentation, overheads, handouts, etc.
>
>
> Earl Moon
>
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> --------------------------------------------------------------------------
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>

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------