TECHNET Archives

August 2002

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: HASL
From:
Rudy Sedlak <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 19 Aug 2002 17:06:09 EDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (21 lines) 
There are products made specifically for the task of cleaning Copper after
Soldermask is removed, before HASL.

Please contact me directly, off Technet for information.

Regards,

Rudy Sedlak
RD Chemical Company

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2