I have a board that needs to be built with material that has a very low
rate of thermal expansion.

I believe polyimide material is what I need; however, I would be interested
in hearing other possibilities that are still reasonably priced.

I would like to get the specifications to see if it does indeed meet our
requirements and would also like some guidance on how to properly specify
this material and prepreg it in a fabrication drawing to ensure I get what
I want.

You input is appreciated.




Dee Stover  [log in to unmask]
Associate Technician Design
National Optical Astronomy Observatory
950 N Cherry Ave
Tucson, AZ 85719
www.noao.edu
520-318-8489
FAX 520-318-8303

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