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August 2002

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Subject:
From:
Ray Klein <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 15 Aug 2002 10:59:30 -0700
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Thanks guys. You answered my question. I can't leave the gold flash showing
for the board life and will cover it with tin/lead during re-flow. We use
gold flash instead of HASL for co-planarity issues with dense fine pitch
BGA's. We have not had copper corrosion problems on the boards before
assembly as thery are in the bare board state for a short time in a
controlled environment.

Ray

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