Scott,

Not being trite, try it.

Earl

----- Original Message -----
From: "Scott Lefebvre" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, August 14, 2002 2:34 PM
Subject: [TN] Pb free components soldered with Sn/Pb


I am currently still using the standard HASL for our board finish and Sn/Pb
solder paste.  We have currently purchase a new chip component (0603) that
has 100% Sn finish on it's terminations.

I would like to know if I should have any concerns using the existing solder
profile.  Will the Sn/Pb solder paste lower the melting point of the lead
termination on the component.  It is my understanding the component
termination will not start to wet until 232 degrees C.  Any input in this
matter would be greatly appreciated.

Thanks in advance.

Scott Lefebvre
> *  [log in to unmask]
>
>
>

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