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August 2002

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Subject:
From:
Scott Lefebvre <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 14 Aug 2002 13:34:46 -0700
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I am currently still using the standard HASL for our board finish and Sn/Pb solder paste.  We have currently purchase a new chip component (0603) that has 100% Sn finish on it's terminations.

I would like to know if I should have any concerns using the existing solder profile.  Will the Sn/Pb solder paste lower the melting point of the lead termination on the component.  It is my understanding the component termination will not start to wet until 232 degrees C.  Any input in this matter would be greatly appreciated.

Thanks in advance.

Scott Lefebvre
> *  [log in to unmask]
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