Rick: Teflon will soften when heated. It is also not as rigid as standard
FR4 material at room temp. If it is all Teflon construction(no external
layers of a more rigid material)you may require fixturing with bottom
supports or a backup board. This is especially true during reflow where it
can sag.

The other issue is if it is a Teflon MLB the internal bonding film is
thermally sensitive and could delaminate if heated or stressed excessively.



Regards

Michael Barmuta

Staff Engineer

Fluke Corp.

Everett WA

425-446-6076

-----Original Message-----
From: Rick Thompson [mailto:[log in to unmask]]
Sent: Wednesday, August 14, 2002 7:37 AM
To: [log in to unmask]
Subject: [TN] Teflon PCB Processing?


We have a customer using a Teflon laminate in one of their designs.  Can
anyone tell me if there are things we should be aware of when processing
these boards through standard surface mount processes (print, place,
reflow, clean, etc) that are different than say standard FR4 type
materials?

Thanks,


Rick Thompson
Ventura Electronics Assembly
2655 Park Center Dr.
Simi Valley, CA 93065

+1 (805) 584-9858   x-304  voice
+1 (805) 584-1529 fax
[log in to unmask]

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