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August 2002

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From:
"d. terstegge" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 14 Aug 2002 17:47:57 +0200
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Hi Rick,

There's probably less adherence of copper to the substrate, which makes
it easier to damage the boards during handling or rework. You should
have a close look at flatness of these boards, and pay attention to the
flexibility.
An advantage is that you don't need to worry about moisture.

Daan Terstegge
Unclassified mail
Personal Website: http://www.smtinfo.net

>>> [log in to unmask] 08/14/02 04:36pm >>>
We have a customer using a Teflon laminate in one of their designs.
Can
anyone tell me if there are things we should be aware of when
processing
these boards through standard surface mount processes (print, place,
reflow, clean, etc) that are different than say standard FR4 type
materials?

Thanks,


Rick Thompson
Ventura Electronics Assembly
2655 Park Center Dr.
Simi Valley, CA 93065

+1 (805) 584-9858   x-304  voice
+1 (805) 584-1529 fax
[log in to unmask]

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