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August 2002

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From:
Tegehall Per-Erik <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 14 Aug 2002 10:03:10 +0200
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Gerard,

The standard has the title "Failure-Mechanism-Driven Reliability
Monitoring". It does not deal specifically with PCB realibility. The purpose
is stated as "This guide is considered a minimum standard for the
application of statistical reliability monitoring techniques to monitor and
improve the reliability of electronic components and subassemblies by
continually evaluating product against potential failure mechanisms".

It has a "Physics-of-Failure" approach similar to JEDEC´s standard JESD34
"Failure-Mechanism-Driven Reliability Qualification of Silicon Devices".

In the Introduction to EIA-659 it is stated that:

"This standard contains a new concept of failure-mechanism-driven monitoring
as opposed to the conventional stress-driven monitoring. To follow this
standard, a supplier must know the failure mechanisms that contribute to the
failure rate of the product and must design and implement tests that monitor
these specific failure mechanisms. A set of baseline tests is included as a
starting point, but these tests should be considered neither complete nor
inviolate." 

Ffor more information about this apparoch see for example Intel´s web page
at www.intel.com/design/PACKTECH/index.htm where they describe their
commitment to apply this appraoch.

Regards
Per-Erik Tegehall
IVF, Sweden

-----Ursprungligt meddelande-----
Från: Gerard O'Brien [mailto:[log in to unmask]]
Skickat: den 12 augusti 2002 22:22
Till: [log in to unmask]
Ämne: [TN] EIA659 standard


I need input/info on an EIA659 standard - supposedly dealing with board
reliabilty - any info would be greatly appreciated

Regards

Gerard O'Brien
Photocircuits

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