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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 1 Aug 2002 21:23:48 -0700 |
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Victor,
Search the fine Technet archives. Back in time, Norm Einarson talked about
studies he did in assessing various plating thickness.
Dave Fish
----- Original Message -----
From: "Victor Hernandez" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, August 01, 2002 2:21 PM
Subject: [TN] Insertion Cycles
> Fellow TechNetters,
> I am desperately search for documents/Publications/Studies on number of
> insertion mating contacts will withstand.
> Hard gold, Au/Ni/Cu, on PCB fingers is a robust finished. It can with
> stand hundreds of insertion cycles. However,
> FLASH, Soft Gold, will not be that reliable. Wow about tin lead
surfaces.
> I know that the thickness/Purity of the
> surface plating plays a great part. I really need HELP from the
DINOSAURS
> out there. I have reviewed IPC-2221.
>
> Victor G. Hernandez
> Component/Material Failure Analysis Eng.
> PS4-1, Rm. 132
> Ofc: 512-725-3471
> Pgr: 512-907-0005
>
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Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
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the BODY (NOT the subject field): SIGNOFF Technet
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Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
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