I never could type on a laptop. Keyboard's just too small and to many typos.

I'm just curious about more of this CAF stuff. I can understand a minimal
amount of hydrolization of salts creating deleterious effects in plated hole
walls, etc. I just don't get how epoxy resin systems, at about .2%
hygroscopisity, get that done. That's really a small percentage.

Polyimide, at about .5%, seems more likely a candidate. Aslo, I could not
imagine drilling holes, however large they may be and still provide some
annular ring, on 10.5 mil centers. Who's doing that? What's behind this but
for you industry leaders seeing down the road 25 years or just needing
something to do in this crappy economy? Poor Howie at Lucent where very
little is going on. I'll bet he is wishing he was in the real world as well.

I also don't understand any product lasting 25 years in this technological
climate. If so, I always warn clients not to use HASL - but especially OSP's.

I also discuss carefully, when needed, what you really need. I can see some
MCM's affected but wouldn't/shouldn't these designs be ASICS instead?

You folks aren't over my head in any way but what possible use is the CAF
stuff but for stuffing a contract with more stuff not needed.

I still need master and assembly drawing notes for "norman" PCB's. Don't you?

MoonMan

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