Oldy but goody, Bill.

I, and who am I really, specify in my master drawing notes vias shall be
tented under BGA devices - especially under .8mm CSP types just to avoid
going to micro vias and all the rest going with it.

I am concerned about your concerns concerning entrapped contamination (I do
love aliteration) in production boards. However, this concern apparently is
not being concerned by industry or is it lately in light of all this
cleanliness stuff?

I still want to know if we need to go back to two ply minimum dielectric
materials. Seems like this CAF stuff is headed back that way.

MoonMan

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