Technet,

One of our customers is requesting 75% solder fillet height on all the
SMT Porcelain capacitors (0805 package size with taller profile) used
for a RF application. We told them based on our experience that the
excess paste volume (and wetting) can not be achieved by our SMT stencil
process. IPC only requires 25% for class 2 products. But they are now
specifying hand soldering these components.

Can anyone see any reason for doing this? I am prepared to go back to
our customer to convince them otherwise (reasons such as extra labour,
process inefficiency, solder joint reliability etc.)

Rgds,
Peter

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