Bev,
There is nothing wrong with the Dip-&-Look test it's simple and you get about as much information as you get from any other test.  However, we rely on JSTD-002A Test S Surface Mount Process Simulation Test for RF shields.  There is nothing better to test the solderability of a part than the actual process you're using for assembly of product.

Regards,
George

George M. Wenger (908)-546-4531 
Reliability Engineer
RF Power Amplifier Group
Andrew Corporation,  40 Technology Drive, NJ 07059
[log in to unmask]



-----Original Message-----
From: Bev Christian [mailto:[log in to unmask]]
Sent: Thursday, August 08, 2002 1:03 PM
To: [log in to unmask]
Subject: [TN] Solderability Testing of RF Shields


TechNetters,
I would appreciate any advice you can give on how I should test these things
for solderability. They are BIG (relative to SOIC20's or 0402's) and have a
high thermal mass.  We have tried using a globule block and a solder bath
with different physical orientations, dips times, etc., but have not been
able to come up with a good set of parameters for doing this.  Any
suggestions, short of the old "dip and look" of the mil standard?

regards,
Bev Christian
Research in Motion

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