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August 2002

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Subject:
From:
Bev Christian <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 8 Aug 2002 13:02:44 -0400
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TechNetters,
I would appreciate any advice you can give on how I should test these things
for solderability. They are BIG (relative to SOIC20's or 0402's) and have a
high thermal mass.  We have tried using a globule block and a solder bath
with different physical orientations, dips times, etc., but have not been
able to come up with a good set of parameters for doing this.  Any
suggestions, short of the old "dip and look" of the mil standard?

regards,
Bev Christian
Research in Motion

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