Hi Phil,
thanks. However, couldn't find humidity indicating labels. E.g. would like to unpeel a 10-to-80%RH from transfer and put on inside of box. Seen such?
Inge
-----Original Message-----
From: Crepeau, Phil [mailto:[log in to unmask]]
Sent: den 8 augusti 2002 01:58
To: [log in to unmask]
Subject: Re: [TN] MSD - Moisture Sensitive Devices
hi ingmar,
here's a u.s. source.
http://www.specialtybags.com/dessicant.cfm
phil
-----Original Message-----
From: Ingemar Hernefjord (EMW)
[mailto:[log in to unmask]]
Sent: Wednesday, August 07, 2002 1:33 AM
To: [log in to unmask]
Subject: Re: [TN] MSD - Moisture Sensitive Devices
Hello Jack,
Thanks for the 033, printed it out quickly and ate it up before someone tried to snap it from my hand.
what about a "chipseal'd" (excuse me Dow for using your good word) semi? Is it regarded as a sealed component? Naked, seminaked or chipseal'd semis is a growing usage area, will there be kinda standard for these too? No? Why?
Ingemar Hernefjord
Ericsson Microwave Systems
PS. Anyone who has a list of humi label suppliers?
-----Original Message-----
From: Jack Crawford [mailto:[log in to unmask]]
Sent: den 6 augusti 2002 22:58
To: [log in to unmask]
Subject: Re: [TN] MSD - Moisture Sensitive Devices
IPC/JEDEC J-STD-033, revision A heading to the printer this week!
J-STD-033 - Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
Provides Surface Mount Device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved with the dry packing process, providing a minimum shelf life of 12 months from the seal date when using sealed dry bags. Developed by IPC and JEDEC. (Revision A is near release. Free notification is available through the IPC New Releases E-mail service.) 13 pages. Released April 1999
Jack Crawford
Director of Assembly Standards and Technology
[log in to unmask]
847-790-5393
fax 847-504-2393
APEX 2003 March 31-April 2 Anaheim CA
www.goapex.org
IPC Printed Circuits EXPO March 25-27 Long Beach CA
http://www.ipcprintedcircuitexpo.org/ <http://www.ipcprintedcircuitexpo.org/>
-----Original Message-----
From: Gujral, Mohit [mailto:[log in to unmask]]
Sent: Tuesday, August 06, 2002 11:29 AM
To: [log in to unmask]
Subject: [TN] MSD - Moisture Sensitive Devices
Folks - are there any industry standards that outline/define the handling of Moisture Sensitive Devices.
Mohit Gujral
Corporate QA Manager - 6 Sigma MBB
Solectron Corporation
847 Gibraltar Drive - B5
Milpitas CA 95035
Ph: 408.957.2757
Pg: 888.991.9474
Mailto:[log in to unmask] <Mailto:[log in to unmask]>
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