Subject: | |
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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 29 Aug 2002 12:01:04 +0100 |
Content-Type: | text/plain |
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I don't know what testing you were expecting for these parts but it's quite
common for a wire bond to function well before reflow but break sometime
during the cycle. Unless you carried out 100% thermal cycling before test the
manufacturer could well ship parts which would fail.
> [log in to unmask] wrote:
>
> Steve,
>
> Looks like someone at On Semiconductor will be as embarrassed as hell!
>
> Let's see them try to blame those assembly problems on YOU!!
>
> Ha!! Someone had a REALLY bad day at the die and wire bonders!
>
> Doesn't say to much for 100% testing before going out the door does it!?
>
>
>
>
> Looks like someone got the scrap bin and ship bins mixed up .... or needed
> to get some 'numbers' ----- unfortunately, have experienced both
>
> NAIL 'EM !!!
>
> Steve Creswick - Gentex Corp
>
> -----Original Message-----
> From: Steve Gregory [mailto:[log in to unmask]]
> Sent: Wednesday, August 28, 2002 4:17 PM
> To: [log in to unmask]
> Subject: [TN] MUX Failures...an update.
>
> Hi All!
>
> The the first results back from failure analysis on the On
> Semiconductor MC14051BD
> parts. I sent 4 parts out that were removed from confirmed test
> failures.
>
> On 2 of the parts the problem was determined at level 1 analysis.
> The other 2 parts will need to go on to level 2 analysis as
> nothing was spotted at level 1.
>
> Go to: http://www.stevezeva.homestead.com and look at the pictures
> of "The Good, The Bad, and The Ugly" and see if you can spot why
> these parts failed...
>
> You might have to look really, really close to see the
> problems...but then again you might not.
>
> -Steve Gregory-
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--
Eric Christison
Mechanical Engineer
STMicroelectronics
33 Pinkhill
Edinburgh
EH12 7BF
tel: +44 (0)131 336 6165
fax: +44 (0)131 336 6001
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