Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 21 Aug 2002 18:10:47 -0400 |
Content-Type: | text/plain |
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Victor,
generally speaking, Au/PdNi/Ni is a better contact finish than Au/Ni. This
is mainly due to the increased hardness and decreased porosity of
Au/PdNi/Ni compared to Au/Ni. The downside of PdNi finish is the Pd price,
which has been high and volatile until few months ago. I will e-mail you
some papers directly to your e-mail address (don't want to overload this
mailing list).
Chen
Chen Xu
Enthone, Inc.
CRL
600 Route 440
Jersey City, NJ07304
Tel. (201)-4346778 ext. 2042 (o)
ext. 2051 (lab)
Fax. (201)-4342529
[log in to unmask]
Victor Hernandez
<Victor_G_Hernandez To: [log in to unmask]
@DELL.COM> cc:
Sent by: TechNet Subject: [TN] Connector Contact Finish
<[log in to unmask]>
08/21/2002 02:29 PM
Please respond to
"TechNet E-Mail
Forum."; Please
respond to
Victor_G_Hernandez
Fellow TechNetters,
Requesting for Pro and Cons on the following Connector Surface Plated
finish;
1.) Base material/Ni/Au - Ni is > 250 micro inches and hard Au
30
micro inches
2). Base material/Ni/PdNi/FLASH Au - Gold FLASH over Pd/Ni ( 30
micro inches Min. over Ni 50 micro inches Min.
Os the robustness of this two application the same . I welcome all
comments and publication on process #2.
Victor G. Hernandez
Component/Material Failure Analysis Eng.
PS4-1, Rm. 132
Ofc: 512-725-3471
Pgr: 512-907-0005
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