Guys,

We use 6-8 micro inch of gold flash over copper on our surface layers.
Mostly these areas are covered with solder paste and don't cause a problem.
We are considering using large areas of the board as heat sinks without
solder paste and are concerned with corrosion of the copper underneath this
very thin gold layer. Has anyone tested for or had experience with this?

Ray Klein

JNI
10945 Vista Sorrento Pkwy
San Diego, CA 92130

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