Hello all

We are discussing in the moment what is the preferred PCB finish for a Low
volume High mix environment.
What is your oppinoun regarding OCC / OSP?
        How long is the solderability good enough after the first reflow
cycle?
        Are ther any process limits?
        Do you define maximum process times for OCC between the first reflow
cycle and the last hand soldering step?
        Is ther variation in OCC in regard to different suppliers / batches?

All infomation is welcome

Siggi

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