Actually there is a JEDEC document describing ball shear testing.  See
JESD22-B117  at www.jedec.org.

Jim

-----Original Message-----
From: Werner Engelmaier [mailto:[log in to unmask]]
Sent: Tuesday, July 09, 2002 5:57 AM
To: [log in to unmask]
Subject: Re: [TN] FW: IPC Standard, BGA Manual Shear Test


Hi Victor,
There is no standardized shear-test for BGAs. The only value such a test has
is to see whether or not the failures occur as interfacial separation [=no
wetting of solder to on of the metallization pads/or weak metallization
layer
adhesion], pad/resin adhesion failure [=proof of good solder joint], or
solder joint fracture [=proof of good solder joint]. Numerical values are
useless. Therefore, a test like Sun Microsystems "chisel test" [yes,=chisel
and hammer judiciously applied] is perfectly adequate.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 386-437-8747, Fax: 386-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com

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