Hi folks,

Here is a question for those of you using power devices that are mounted to heat sinks.  For years we all used thermal grease.  Then several new materials came on the market which are supposed to be better.  For sure they reduce the amount of hand labor and increase the uniformity of power device assembly.

My question is in regards to the newest "Phase Change" materials.  When a device fails and must be replaced, what are you doing to prepare the heat sink surface to remove traces of any old thermal material in preparation of installing the new thermal interface material and the new power device?

This stuff seems to resist cleaning.

Thanks in advance.

Phil Nutting

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